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Semiconductors




Solder Bump Flattening technology and Ball Mounting process in BGA and CSP manufacturing

MAXIS Engineering Inc.

We provide solutions that enable high-quality production in BGA and CSP manufacturing.
Solder Bump Flattening Technology by MAXIS ENGINEERING INC.
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About Bump Flattening
It occurs when pressing the solder bumps or projections used in the construction of semiconductor substrate boards, flattening their top surface.
Why should solder bumps be flattened?

When making BGA and CSP connections using solder bumps in SMT and FC, each bump must connect to both passive electrode terminals at the same time. To improve connection reliability, solder bump heights must be uniform and flat.

In flip chip assembly, the spherical surface of the bumps can cause mounting slippage. Flattening the bumps is effective in preventing slippage.

Bump flattening improves flow stability and connectivity.

The flattening press breaks the oxide layer on the surface of the bump, improving connectivity.


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Flattening Tool

Main features of the tool include:

High thermal conductivity

High hardness

Low thermal deformation

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Athlete FA Corporation

Ball Mounting Process by Athlete FA Corporation

Ball Mounting Technology
In the ubiquitous era, mobile devices (PCs, smartphones, etc.) demand higher functionality, including lighter weight and smaller size through miniaturization. Ball Mounting technology is the core technology for forming electronic component electrodes that makes this possible.

World’s first mounting of φ30μm balls on φ12 thin wafers
For the first time in the world, we achieved mounting solder balls with a diameter of φ30 μm and 50 μm pitch on φ12 wafers (thin substrates). As higher-speed processes are increasingly required, this technology is expected to be used in next-generation CPUs and ultra-thin, high-density mounting for advanced logic chips such as graphics and AI chips. (Photo below: after reflow oven)
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Ball Mounting Process by Athlete FA Corporation
Achieves stable ball mounting through Athlete FA’s original batch transfer method.
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